Semiconductor Manufacturing
Nordson is Electronics Dependability
Enhanced Reliability for Future Technology
We rely on digital technologies more than ever. Electronics help us communicate, support work, and automate our personal lives. This requires 5G infrastructure, server networks, mobile and IoT devices, cloud computing, autonomous driving, financial tech, and more. If you’re supporting an IDM, foundry, or OSAT, you’re continually seeking solutions to meet the demand for smaller, more powerful chips to give a tech-hungry world the products they demand. And they must be reliable. Explore our advanced fluid dispensing and plasma surface treatments designed to help your products deliver a lifespan of reliability.
Wafer-Level Packaging: Advances Continue
Wafer-level packaging (WLP) is an advanced packaging technique focused on streamlining the chip production process. WLP encompasses different integration approaches such as fan-in/fan-out, chip-first/chip-last, chip-on-wafer, and various other packaging types. WLP is the cornerstone of heterogeneous integration (HI), a key trend in semiconductor manufacturing aimed at future power, performance, area, and cost (PPAC) improvements. HI includes wafer-level system-in-package (SiP) architectures, 2D, 2.5D, and 3D integrated circuit (IC) stacks, and, most recently, chiplet architecture applications.
Panel-Level Packaging: SEMI 3D20 Clears the Path
Another advanced packaging technique, panel-level packaging (PLP), moves semiconductor packaging to a large-panel format with promising potential to reduce cost by improving efficiency and economies of scale. In 2019, SEMI Standard 3D20 was released, standardizing panel sizes and opening the door for equipment manufacturers to invest in developing tools to enable PLP.
Unlike WLP, where packages are produced on round 200mm or 300mm wafers, PLP processes packages on large square panels that accommodate thousands of additional packages. For example, a 300mm wafer can process 2,500 6mm x 6mm packages, but a 600mm x 600mm panel can accommodate 12,000 packages, according to Advanced Semiconductor Engineering Inc (ASE). The choice between WLP and PLP may lie primarily in the produced volumes, with PLP better suited to higher-volume products.
Material Handling: We’re Poised to Deliver Greater Automation
We’re currently partnering with leading semiconductor manufacturers to integrate our systems with their Overhead Hoist Transport (OHT) and Automated Guided Vehicle (AGV) material handling systems to advance traceability, lights-out factory, Industry 4.0, and factory of the future objectives.
Fluid Dispensing: Has Always Played an Important Role
Fluid dispensing has long played an essential role in semiconductor packaging applications, providing adhesion, structural integrity, thermal and electrical conductivity, protection, and more. There is constant pressure to increase dispensing productivity in parallel with packaging advancements. As chip populations increase, dispensing applications must deliver smaller and smaller amounts of fluid with precision and consistency within small form factors and into micron-sized gaps between chips and components. And to advance reliability and throughput, high-speed, precise dispensing is crucial.
Advanced ASYMTEK Solutions, Many Applications
- System in package (SiP)
- Integrated passive device
- CoW
- CoWos
- BGA
- PoP
- CSP
- PCB/Flex circuit
- Flip-chip underfill
- Flux dispensing for flip-chip
- CPU/GPU lid sealing
- Thermal interface material dispensing
- Sealing for lid attachment
See Solutions in Action
Forte MAX Dual-Valve
Easily accommodate skewed parts with automated real-time adjustment.
Learn moreIntelliJet® Jetting System
Prevent die contamination with small dot sizes and narrow stream widths.
Learn moreExplore ASYMTEK Fluid Dispensing
Vantage® Series
Our most advanced dispensing platform. Designed for high-end semiconductor packaging and assembly.
Learn moreASYMTEK Forte® Series
Exceptional dispensing productivity and accuracy for high-volume consumer electronics, printed circuit board assembly,...
Learn moreASYMTEK Spectrum II S2-900 Precision Fluid Dispensing System
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and...
Learn moreIntelliJet® Jetting System
The IntelliJet® Jetting System with patented ReadiSet® Jet Cartridge delivers cutting-edge reliability and micro dot...
Learn morePlasma Surface Treatment
Plasma removes impurities and activates surfaces to enhance flow and adhesion for improved package reliability.
Advanced MARCH Solutions, Many Applications
- Wafer cleaning
- Descum for wafer-level processing
- Stripping and etch for wafer-level processing
- VIA cleaning for wafer-level processing
- Wafer pre-treatment
- BCB and UBM adhesion
- Dielectric patterning
- Bump adhesion
- Pre-die attach treatment
- Pre-wire bond treatment
- Pre-underfill treatment
- Pre-encapsulation and molding treatment
- MEMs
Stratosphere™ Plasma System
Explore MARCH Plasma Surface Treatment
AP Batch Series
The AP Batch Series offers high-performance plasma treatment for batch manufacturing and R&D environments.
Learn moreMARCH FlexTRAK® Series
FlexTRAK plasma treatment systems offer high-throughput, strip-type, and inline boat processing for advanced...
Learn moreMARCH StratoSPHERE™ Plasma Treatment System
The StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications....
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