Overview

The FlexTRAK/FlexTRAK-S, FlexTRAK-CD/FlexTRAK-CDS, FlexTRAK-2MB, and FlexTRAK-SHS systems suit various plasma cleaning, surface activation, and adhesion improvement applications.

You’ll receive your new system with minimal lead time when you choose a standard system package.

The FlexTRAK Series:

• State-of-the-art F3 plasma chamber technology for direct or ion-free processing on elevated rails for a conductive electrode or directly on an insulated electrode for exceptional uniformity, plasma efficiency, throughput, and scalability.
• Flexible chamber configurations support contamination removal, etching, and surface activation before die attach, wire bond, molding and encapsulation, and underfill applications.
• The systems accommodate various form factors, including lead frames, carriers, Jedec/Auer® boats, strips, and laminates.

Choose a System Package:

• Essential – A compact automated system that uniformly treats microelectronic components for advanced semiconductor packaging applications. Low maintenance and dependability deliver excellent cost-of-ownership. The Essential system package is available for all FlexTRAK systems.
• Productivity – Accelerate throughput and yield with fully automated plasma processing and advanced jam detection optimized for thin or warped strips. The Productivity system package is available for the FlexTRAK-SHS system.